NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
3. Ordering information
Table 4.
Ordering information
Package
Name
BAV756S
BAW56
BAW56M
BAW56S
BAW56T
BAW56W
SC-88
-
SC-101
SC-88
SC-75
SC-70
Description
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 3 leads
leadless ultra small plastic package; 3 solder lands;
body 1.0
×
0.6
×
0.5 mm
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
Version
SOT363
SOT23
SOT883
SOT363
SOT416
SOT323
Type number
4. Marking
Table 5.
BAV756S
BAW56
BAW56M
BAW56S
BAW56T
BAW56W
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Marking codes
Marking code
A7*
A1*
S5
A1*
A1
A1*
Type number
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per diode
V
RRM
V
R
I
F
repetitive peak reverse
voltage
reverse voltage
forward current
BAV756S
BAW56
BAW56M
BAW56S
BAW56T
BAW56W
BAV756S_BAW56_SER_5
Parameter
Conditions
Min
-
-
Max
90
90
250
215
150
250
150
150
Unit
V
V
mA
mA
mA
mA
mA
mA
T
s
= 60
°C
T
amb
≤
25
°C
T
amb
≤
25
°C
T
s
= 60
°C
T
s
= 90
°C
T
amb
≤
25
°C
-
-
-
-
-
-
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 26 November 2007
3 of 15
PHILIPS [ NXP SEMICONDUCTORS ]
