NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
Type number
BAV756S
BAW56
BAW56M
BAW56S
BAW56T
BAW56W
[1]
[2]
[3]
Package
SOT363
SOT23
SOT883
SOT363
SOT416
SOT323
Description
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
Packing quantity
3000
-115
-125
-215
-
-115
-125
-115
-115
10000
-135
-165
-235
-315
-135
-165
-135
-135
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
11. Soldering
2.90
2.50
0.85
3.00
0.85
1.30
2
1
solder lands
2.70
3
solder resist
solder paste
occupied area
0.60
(3x)
Dimensions in mm
0.50 (3x)
0.60 (3x)
1.00
3.30
sot023
Fig 12. Reflow soldering footprint BAW56 (SOT23/TO-236AB)
BAV756S_BAW56_SER_5
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 26 November 2007
9 of 15
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