欢迎访问ic37.com |
会员登录 免费注册
发布采购

30151-33 参数 Datasheet PDF下载

30151-33图片预览
型号: 30151-33
PDF下载: 下载PDF文件 查看货源
内容描述: 的Geode ™ GXM处理器与MMX支持集成的x86解决方案 [Geode⑩ GXm Processor Integrated x86 Solution with MMX Support]
分类和应用:
文件页数/大小: 244 页 / 4221 K
品牌: NSC [ National Semiconductor ]
 浏览型号30151-33的Datasheet PDF文件第32页浏览型号30151-33的Datasheet PDF文件第33页浏览型号30151-33的Datasheet PDF文件第34页浏览型号30151-33的Datasheet PDF文件第35页浏览型号30151-33的Datasheet PDF文件第37页浏览型号30151-33的Datasheet PDF文件第38页浏览型号30151-33的Datasheet PDF文件第39页浏览型号30151-33的Datasheet PDF文件第40页  
Signal Definitions (Continued)  
2.4 POWER PLANES  
Figure 2-6 shows layout recommendations for splitting the  
power plane between VCC2 (core: 2.9V) and VCC3 (I/O:  
3.3V) volts in the BGA package.  
Figure 2-7 shows layout recommendations for splitting the  
power plane between VCC2 (core: 2.9V) and VCC3 (I/O:  
3.3V) volts for the GXm in the SPGA package.  
The illustration assumes there is one power plane, and no  
components on the back of the board  
3.3V Plane  
(VCC3)  
26  
A
1
A
2.9V Plane  
(VCC2)  
3.3V Plane  
(VCC3)  
Geode™ GXm  
Processor  
352 BGA - Top View  
2.9V Plane  
(VCC2)  
AF  
AF  
1
26  
Legend  
3.3V Plane  
(VCC3)  
= High frequency capacitor  
= 220µF, low ESR capacitor  
= 3.3V connection  
= 2.9V connection  
Figure 2-6. BGA Recommended Split Power Plane and Decoupling  
www.national.com  
36  
Revision 3.1  
 复制成功!