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30151-33 参数 Datasheet PDF下载

30151-33图片预览
型号: 30151-33
PDF下载: 下载PDF文件 查看货源
内容描述: 的Geode ™ GXM处理器与MMX支持集成的x86解决方案 [Geode⑩ GXm Processor Integrated x86 Solution with MMX Support]
分类和应用:
文件页数/大小: 244 页 / 4221 K
品牌: NSC [ National Semiconductor ]
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Signal Definitions (Continued)  
2.3 SUBSYSTEM SIGNAL CONNECTIONS  
As previously stated, the GXm Integrated Subsystem with  
MMX support consists of two chips: the GXm Processor  
and the CS5530 I/O companion. Figure 2-4 shows the  
signal connections between the processor and the I/O  
companion chip.  
SYSCLK  
SERIALP  
IRQ13  
GX_CLK  
PSERIAL  
IRQ13  
SMI#  
SMI#  
PCLK  
PCLK  
DCLK  
DCLK  
CRT_HSYNC  
CRT_VSYNC  
HSYNC  
VSYNC  
Exclusive  
Interconnect  
(Note)  
PIXEL[17:0]  
PIXEL[23:0]  
Signals  
Not needed if  
CRT only (no TFT)  
FP_HSYNC  
FP_VSYNC  
ENA_DISP  
VID_VAL  
FP_HSYNC  
FP_VSYNC  
FP_ENA_DISP  
VID_VAL  
(Do not connect to  
any other device)  
VID_CLK  
VID_CLK  
VID_DATA[7:0]  
VID_RDY  
RESET  
VID_DATA[7:0]  
VID_RDY  
CPU_RST  
INTR  
INTR  
Geode™ CS5530  
I/O Companion  
Geode™ GXm  
Processor  
SUSP#  
SUSPA#  
AD[31:0]  
C/BE[3:0]#  
PAR  
SUSP#  
SUSPA#  
AD[31:0]  
C/BE[3:0]#  
PAR  
Nonexclusive  
Interconnect  
Signals  
FRAME#  
IRDY#  
TRDY#  
STOP#  
LOCK#  
DEVSEL#  
PERR#  
SERR#  
REQ0#  
GNT0#  
FRAME#  
IRDY#  
TRDY#  
STOP#  
LOCK#  
DEVSEL#  
PERR#  
SERR#  
REQ#  
(May also connect  
to other circuitry)  
GNT#  
Note: Refer to Figure 2-5 for interconnection of these lines.  
Figure 2-4. Subsystem Signal Connections  
www.national.com  
34  
Revision 3.1  
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