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30151-33 参数 Datasheet PDF下载

30151-33图片预览
型号: 30151-33
PDF下载: 下载PDF文件 查看货源
内容描述: 的Geode ™ GXM处理器与MMX支持集成的x86解决方案 [Geode⑩ GXm Processor Integrated x86 Solution with MMX Support]
分类和应用:
文件页数/大小: 244 页 / 4221 K
品牌: NSC [ National Semiconductor ]
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Signal Definitions (Continued)  
2.2.6  
Internal Test and Measurement Signals  
BGA SPGA  
Signal Name  
Pin No. Pin No.  
Type  
Description  
TMS  
TEST  
TDP  
H1  
(PU)  
N3  
(PU)  
I
Test Mode Select  
JTAG test-mode select.  
This pin is internally connected to a 20-kohm pull-up resistor.  
F3  
(PD)  
J5  
(PD)  
I
Test  
Test-mode input.  
This pin is internally connected to a 20-kohm pull-down resistor.  
Thermal Diode Positive  
E24  
D26  
F36  
E37  
O
TDP is the positive terminal of the thermal diode on the die. The  
diode is used to do thermal characterization of the device in a  
system. This signal works in conjunction with TDN.  
TDN  
O
Thermal Diode Negative  
TDN is the negative terminal of the thermal diode on the die. The  
diode is used to do thermal characterization of the device in a  
system. This signal works in conjunction with TDP.  
Revision 3.1  
33  
www.national.com  
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