Signal Definitions (Continued)
2.2.6
Internal Test and Measurement Signals
BGA SPGA
Signal Name
Pin No. Pin No.
Type
Description
TMS
TEST
TDP
H1
(PU)
N3
(PU)
I
Test Mode Select
JTAG test-mode select.
This pin is internally connected to a 20-kohm pull-up resistor.
F3
(PD)
J5
(PD)
I
Test
Test-mode input.
This pin is internally connected to a 20-kohm pull-down resistor.
Thermal Diode Positive
E24
D26
F36
E37
O
TDP is the positive terminal of the thermal diode on the die. The
diode is used to do thermal characterization of the device in a
system. This signal works in conjunction with TDN.
TDN
O
Thermal Diode Negative
TDN is the negative terminal of the thermal diode on the die. The
diode is used to do thermal characterization of the device in a
system. This signal works in conjunction with TDP.
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