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V58C2128804S 参数 Datasheet PDF下载

V58C2128804S图片预览
型号: V58C2128804S
PDF下载: 下载PDF文件 查看货源
内容描述: 高性能2.5伏128兆位的DDR SDRAM [HIGH PERFORMANCE 2.5 VOLT 128 Mbit DDR SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 59 页 / 922 K
品牌: MOSEL [ MOSEL VITELIC, CORP ]
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V58C2128(804/404/164)S  
Signal Pin Description  
Pin  
Type  
Signal Polarity  
Function  
CK  
CK  
Input  
Pulse  
Positive  
Edge  
The system clock input. All inputs except DQs and DMs are sampled on the rising edge  
of CK.  
CKE  
Input  
Input  
Level Active High Activates the CK signal when high and deactivates the CK signal when low, thereby ini-  
tiates either the Power Down mode, or the Self Refresh mode.  
CS  
Pulse Active Low CS enables the command decoder when low and disables the command decoder when  
high. When the command decoder is disabled, new commands are ignored but previous  
operations continue.  
RAS,CAS  
WE  
Input  
Pulse Active Low When sampled at the positive rising edge of the clock, CAS, RAS, and WE define the  
command to be executed by the SDRAM.  
DQS  
Input/  
Pulse Active High Active on both edges for data input and output.  
Center aligned to input data  
Output  
Edge aligned to output data  
A0 - A11  
Input  
Level  
During a Bank Activate command cycle, A0-A11 defines the row address (RA0-RA11)  
when sampled at the rising clock edge.  
During a Read or Write command cycle, A0-An defines the column address (CA0-CAn)  
when sampled at the rising clock edge.CAn depends on the SDRAM organization:  
32M x 4 DDR CAn = CA9, A11  
16M x 8 DDR CAn = CA9  
8M x 16 DDR CAn = CA8  
In addition to the column address, A10(=AP) is used to invoke autoprecharge operation  
at the end of the burst read or write cycle. If A10 is high, autoprecharge is selected and  
BA0, BA1 defines the bank to be precharged. If A10 is low, autoprecharge is disabled.  
During a Precharge command cycle, A10(=AP) is used in conjunction with BA0 and BA1  
to control which bank(s) to precharge. If A10 is high, all four banks will be precharged  
simultaneously regardless of state of BA0 and BA1.  
BA0,  
BA1  
Input  
Level  
Level  
Selects which bank is to be active.  
DQx  
Input/  
Data Input/Output pins operate in the same manner as on conventional DRAMs.  
Output  
DM,  
LDM,  
UDM  
Input  
Pulse Active High In Write mode, DM has a latency of zero and operates as a word mask by allowing input  
data to be written if it is low but blocks the write operation if is high for x 16 LDM  
corresponds to data on DQ0-DQ7, UDM corresponds to data on DQ8-DQ15.  
QFC  
Output  
Level  
Active Low FET Control: Output during every read and write access. Can be used to control isolation  
switches on modules.  
VDD, VSS Supply  
Power and ground for the input buffers and the core logic.  
VDDQ  
VSSQ  
Supply  
Isolated power supply and ground for the output buffers to provide improved noise  
immunity.  
VREF  
Input  
Level  
SSTL Reference Voltage for Inputs  
V58C2128(804/404/164)S Rev. 1.6 March 2002  
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