ADVANCE
4 MEG x 8, 4 MEG x 9, 2 MEG x 18, 1 MEG x 36
1.8V VDD, HSTL, QDRIIb2 SRAM
Figure 11
165-Ball FBGA
0.850 0.075
SEATING PLANE
C
0.12 C
10.00
1.00
TYP
BALL A11
165X 0.45
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
BALL A1
1.20 MAX
PIN A1 ID
PIN A1 ID
REFLOW DIAMETER IS Ø 0.40
1.00
TYP
14.00
17.00 0.10
7.00 0.05
8.50 0.10
MOLD COMPOUND: EPOXY NOVOLAC
7.50 0.05
5.00 0.05
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
15.00 0.10
SOLDER BALL PAD: Ø .33mm
NOTE:
1. All dimensions are in millimeters.
DATA SHEET DESIGNATION
Advance: This data sheet contains initial descriptions of products still under development.
®
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E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron and the M logo are registered trademarks and SyncBurst and the Micron logo are trademarks of Micron Technology, Inc.
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress Semiconductor, IDT, Micron Technology,
Inc., NEC, and Samsung.
36Mb: 1.8V VDD, HSTL, QDRIIb2 SRAM
MT54W2MH18B_A.fm - Rev 9/02
©2002, Micron Technology Inc.
26
MICRON [ MICRON TECHNOLOGY ]
