ADVANCE
128Mb: x16, x32
MOBILE SDRAM
DBFCF
FBGA DEVICE MARKING
Due to the size of the package, Micron’s standard part
number is not printed on the top of each device. Instead,
an abbreviated device mark comprised of a five-digit
alphanumericcodeisused. Theabbreviateddevicemarks
are cross referenced to Micron part numbers in Table 1.
Speed Grade
B = -10
C = -8
Width ( I/Os)
D = x16
G = x32
Device Density
F
=
128Mb
Product Type
N
P
V
Z
=
=
=
=
2.5V SDR SDRAM, Low Power version (54-ball, 8 x 9)
3.3V SDR SDRAM, Low Power version (54-ball, 8 x 9)
2.5V SDR SDRAM, Low Power version (90-ball, 11 x 13)
3.3V SDR SDRAM, Low Power version (90-ball, 11 x 13)
Product Group
D
Z
= DRAM
= DRAM ENGINEERING SAMPLE
CROSS REFERENCE FOR FBGA OR VFBGA DEVICE MARKING
ENGINEERING
SAMPLE
ZVFGC
PRODUCTION
PART NUMBER
MT48V4M32LFFC-8
MT48LC4M32LFFC-10
MT48V8M16LFFF-10
MT48LC8M16LFFF-8
ARCHITECTURE
4 Meg x 32
4 Meg x 32
8 Meg x 16
8 Meg x 16
FBGA/VFBGA
90-pin, 11 x 13
90-pin, 11 x 13
54-ball, 8 x 9
54-ball, 8 x 9
MARKING
DVFGC
DZFGB
ZZFGB
ZNFDB
ZPFDC
DNFDB
DPFDC
DATA SHEET DESIGNATION
Advance: This data sheet contains initial descriptions of products still under development.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.
128Mb: x16, x32 Mobile SDRAM
MobileY95W_3V_F.p65 – Rev. F; Pub. 9/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
61
MICRON [ MICRON TECHNOLOGY ]
