ADVANCE
128Mb: x16, x32
MOBILE SDRAM
54-BALL VFBGA (8mm x 9mm)
0.70 0.075
SEATING PLANE
0.08 C
C
54X ∅0.35
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.33
BALL A9
6.40
0.80
TYP
1.0 MAX
BALL A1 ID
BALL A1
BALL A1 ID
0.80
TYP
6.40
9.00 0.10
C
L
3.20 0.05
4.50 0.05
C
L
3.20 0.05
4.00 0.05
8.00 0.10
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
NOTE: 1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
128Mb: x16, x32 Mobile SDRAM
MobileY95W_3V_F.p65 – Rev. F; Pub. 9/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
59
MICRON [ MICRON TECHNOLOGY ]
