ADVANCE
128Mb: x16, x32
MOBILE SDRAM
90-BALL FBGA (11mm x 13mm)
.850 .075
.10
C
SEATING PLANE
C
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb.
Or 62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: Ø .33mm
11.00 .10
6.40
.80
SUBSTRATE: PLASTIC LAMINATE
ENCAPSULATION MATERIAL: EPOXY NOVOLAC
90X Ø 0.45
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION.
THE PRE-REFLOW DIAMETER IS Ø 0.40mm
BALL A1 ID
BALL A1 ID
TYP
BALL A9
BALL A1
6.50 .05
13.00 .10
C
L
11.20
.80
5.60 .05
TYP
C
L
3.20 .05
1.20 MAX
5.50 .05
(Bottom View)
NOTE: 1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.33mm 0.025mm.
128Mb: x16, x32 Mobile SDRAM
MobileY95W_3V_F.p65 – Rev. F; Pub. 9/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
60
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