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MT41J256M4 参数 Datasheet PDF下载

MT41J256M4图片预览
型号: MT41J256M4
PDF下载: 下载PDF文件 查看货源
内容描述: DDR3 SDRAM MT41J256M4 â ????梅格32 ×4× 8银行MT41J128M8 â ????梅格16 ×8× 8银行MT41J64M16 â ???? 8梅格×16× 8银行 [DDR3 SDRAM MT41J256M4 – 32 Meg x 4 x 8 banks MT41J128M8 – 16 Meg x 8 x 8 banks MT41J64M16 – 8 Meg x 16 x 8 banks]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 214 页 / 2938 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1Gb: x4, x8, x16 DDR3 SDRAM  
Features  
List of Figures  
Figure 1: DDR3 Part Numbers .......................................................................................................................... 2  
Figure 2: Simplified State Diagram ................................................................................................................. 11  
Figure 3: 256 Meg x 4 Functional Block Diagram ............................................................................................. 14  
Figure 4: 128 Meg x 8 Functional Block Diagram ............................................................................................. 15  
Figure 5: 64 Meg x 16 Functional Block Diagram ............................................................................................. 15  
Figure 6: 08-Ball FBGA – x4, x8 (Top View) ...................................................................................................... 16  
Figure 0: 86-Ball FBGA – x4, x8 (Top View) ...................................................................................................... 10  
Figure 8: 96-Ball FBGA – x16 (Top View) ......................................................................................................... 18  
Figure 9: 08-Ball FBGA – x4, x8 (JP) ................................................................................................................ 25  
Figure 1±: 08-Ball FBGA – x4, x8 (HX) ............................................................................................................. 26  
Figure 11: 86-Ball FBGA – x4, x8 (BY) .............................................................................................................. 20  
Figure 12: 96-Ball FBGA – x16 (LA) ................................................................................................................. 28  
Figure 13: 96-Ball FBGA – x16 (JT) .................................................................................................................. 29  
Figure 14: Thermal Measurement Point ......................................................................................................... 33  
Figure 15: Input Signal .................................................................................................................................. 49  
Figure 16: Overshoot ..................................................................................................................................... 5±  
Figure 10: Undershoot ................................................................................................................................... 5±  
Figure 18: VIX for Differential Signals .............................................................................................................. 52  
Figure 19: Single-Ended Requirements for Differential Signals ........................................................................ 52  
Figure 2±: Definition of Differential AC-Swing and tDVAC ............................................................................... 53  
Figure 21: Nominal Slew Rate Definition for Single-Ended Input Signals .......................................................... 55  
Figure 22: Nominal Differential Input Slew Rate Definition for DQS, DQS# and CK, CK# .................................. 56  
Figure 23: ODT Levels and I-V Characteristics ................................................................................................ 50  
Figure 24: ODT Timing Reference Load .......................................................................................................... 6±  
Figure 25: tAON and tAOF Definitions ............................................................................................................ 61  
Figure 26: tAONPD and tAOFPD Definitions ................................................................................................... 61  
Figure 20: tADC Definition ............................................................................................................................. 62  
Figure 28: Output Driver ................................................................................................................................ 63  
Figure 29: DQ Output Signal .......................................................................................................................... 0±  
Figure 3±: Differential Output Signal .............................................................................................................. 01  
Figure 31: Reference Output Load for AC Timing and Output Slew Rate ........................................................... 01  
Figure 32: Nominal Slew Rate Definition for Single-Ended Output Signals ....................................................... 02  
Figure 33: Nominal Differential Output Slew Rate Definition for DQS, DQS# .................................................... 03  
Figure 34: Nominal Slew Rate and tVAC for tIS (Command and Address – Clock) ............................................. 1±3  
Figure 35: Nominal Slew Rate for tIH (Command and Address – Clock) ........................................................... 1±4  
Figure 36: Tangent Line for tIS (Command and Address – Clock) .................................................................... 1±5  
Figure 30: Tangent Line for tIH (Command and Address – Clock) .................................................................... 1±6  
Figure 38: Nominal Slew Rate and tVAC for tDS (DQ – Strobe) ......................................................................... 112  
Figure 39: Nominal Slew Rate for tDH (DQ – Strobe) ...................................................................................... 113  
Figure 4±: Tangent Line for tDS (DQ – Strobe) ................................................................................................ 114  
Figure 41: Tangent Line for tDH (DQ – Strobe) ............................................................................................... 115  
Figure 42: Refresh Mode ............................................................................................................................... 122  
Figure 43: DLL Enable Mode to DLL Disable Mode ........................................................................................ 124  
Figure 44: DLL Disable Mode to DLL Enable Mode ........................................................................................ 125  
Figure 45: DLL Disable tDQSCK .................................................................................................................... 126  
Figure 46: Change Frequency During Precharge Power-Down ........................................................................ 128  
Figure 40: Write Leveling Concept ................................................................................................................. 129  
Figure 48: Write Leveling Sequence ............................................................................................................... 132  
Figure 49: Write Leveling Exit Procedure ....................................................................................................... 133  
Figure 5±: Initialization Sequence ................................................................................................................. 135  
PDF: 09005aef826aa906  
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
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