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MT41J256M4 参数 Datasheet PDF下载

MT41J256M4图片预览
型号: MT41J256M4
PDF下载: 下载PDF文件 查看货源
内容描述: DDR3 SDRAM MT41J256M4 â ????梅格32 ×4× 8银行MT41J128M8 â ????梅格16 ×8× 8银行MT41J64M16 â ???? 8梅格×16× 8银行 [DDR3 SDRAM MT41J256M4 – 32 Meg x 4 x 8 banks MT41J128M8 – 16 Meg x 8 x 8 banks MT41J64M16 – 8 Meg x 16 x 8 banks]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 214 页 / 2938 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1Gb: x4, x8, x16 DDR3 SDRAM  
Features  
DLL Disable Mode ..................................................................................................................................... 123  
Input Clock Frequency Change ...................................................................................................................... 120  
Write Leveling ............................................................................................................................................... 129  
Write Leveling Procedure ........................................................................................................................... 131  
Write Leveling Mode Exit Procedure ........................................................................................................... 133  
Initialization ................................................................................................................................................. 134  
Mode Registers .............................................................................................................................................. 136  
Mode Register ± (MR±) ................................................................................................................................... 130  
Burst Length ............................................................................................................................................. 130  
Burst Type ................................................................................................................................................. 138  
DLL RESET ................................................................................................................................................ 139  
Write Recovery .......................................................................................................................................... 139  
Precharge Power-Down (Precharge PD) ...................................................................................................... 14±  
CAS Latency (CL) ....................................................................................................................................... 14±  
Mode Register 1 (MR1) ................................................................................................................................... 141  
DLL Enable/DLL Disable ........................................................................................................................... 141  
Output Drive Strength ............................................................................................................................... 142  
OUTPUT ENABLE/DISABLE ...................................................................................................................... 142  
TDQS Enable ............................................................................................................................................. 142  
On-Die Termination .................................................................................................................................. 143  
WRITE LEVELING ..................................................................................................................................... 143  
POSTED CAS ADDITIVE Latency ................................................................................................................ 143  
Mode Register 2 (MR2) ................................................................................................................................... 144  
CAS Write Latency (CWL) ........................................................................................................................... 145  
AUTO SELF REFRESH (ASR) ....................................................................................................................... 145  
SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 146  
SRT vs. ASR ............................................................................................................................................... 146  
DYNAMIC ODT ......................................................................................................................................... 146  
Mode Register 3 (MR3) ................................................................................................................................... 140  
MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 140  
MPR Functional Description ...................................................................................................................... 148  
MPR Register Address Definitions and Bursting Order ................................................................................. 149  
MPR Read Predefined Pattern .................................................................................................................... 155  
MODE REGISTER SET (MRS) Command ........................................................................................................ 155  
ZQ CALIBRATION Operation ......................................................................................................................... 156  
ACTIVATE Operation ..................................................................................................................................... 150  
READ Operation ............................................................................................................................................ 159  
WRITE Operation .......................................................................................................................................... 10±  
DQ Input Timing ....................................................................................................................................... 108  
PRECHARGE Operation ................................................................................................................................. 18±  
SELF REFRESH Operation .............................................................................................................................. 18±  
Extended Temperature Usage ........................................................................................................................ 182  
Power-Down Mode ........................................................................................................................................ 183  
RESET Operation ........................................................................................................................................... 191  
On-Die Termination (ODT) ............................................................................................................................ 193  
Functional Representation of ODT ............................................................................................................. 193  
Nominal ODT ............................................................................................................................................ 193  
Dynamic ODT ............................................................................................................................................... 195  
Dynamic ODT Special Use Case ................................................................................................................. 195  
Functional Description .............................................................................................................................. 195  
Synchronous ODT Mode ................................................................................................................................ 2±1  
ODT Latency and Posted ODT .................................................................................................................... 2±1  
PDF: 09005aef826aa906  
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
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‹ 2006 Micron Technology, Inc. All rights reserved.  
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