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MT41J256M4 参数 Datasheet PDF下载

MT41J256M4图片预览
型号: MT41J256M4
PDF下载: 下载PDF文件 查看货源
内容描述: DDR3 SDRAM MT41J256M4 â ????梅格32 ×4× 8银行MT41J128M8 â ????梅格16 ×8× 8银行MT41J64M16 â ???? 8梅格×16× 8银行 [DDR3 SDRAM MT41J256M4 – 32 Meg x 4 x 8 banks MT41J128M8 – 16 Meg x 8 x 8 banks MT41J64M16 – 8 Meg x 16 x 8 banks]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 214 页 / 2938 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1Gb: x4, x8, x16 DDR3 SDRAM  
Electrical Specifications – DC and AC  
Electrical Specifications – DC and AC  
DC Operating Conditions  
Table 22: DC Electrical Characteristics and Operating Conditions  
All voltages are referenced to VSS  
Parameter/Condition  
Supply voltage  
Symbol  
VDD  
Min  
1.425  
1.425  
–2  
Nom  
1.5  
1.5  
Max  
1.575  
1.575  
2
Unit Notes  
V
V
1, 2  
1, 2  
I/O supply voltage  
VDDQ  
II  
Input leakage current  
μA  
Any input 0V VIN VDD, VREF pin 0V VIN 1.1V  
(All other pins not under test = 0V)  
VREF supply leakage current  
IVREF  
–1  
1
μA  
4
VREFDQ = VDD/2 or VREFCA = VDD/2  
(All other pins not under test = 0V)  
1. VDD and VDDQ must track one another. VDDQ must be VDD. VSS = VSSQ  
.
Notes:  
2. VDD and VDDQ may include AC noise of 50mV (250 kHz to 20 MHz) in addition to the  
DC (0 Hz to 250 kHz) specifications. VDD and VDDQ must be at same level for valid AC  
timing parameters.  
3. VREF (see Table 23).  
4. The minimum limit requirement is for testing purposes. The leakage current on the VREF  
pin should be minimal.  
Input Operating Conditions  
Table 23: DC Electrical Characteristics and Input Conditions  
All voltages are referenced to VSS  
Parameter/Condition  
Symbol  
VIL  
Min  
VSS  
Nom  
n/a  
Max  
See Table 24  
VDD  
Unit Notes  
VIN low; DC/commands/address busses  
VIN high; DC/commands/address busses  
Input reference voltage command/address bus  
I/O reference voltage DQ bus  
V
V
VIH  
See Table 24  
0.49 × VDD  
0.49 × VDD  
VSS  
n/a  
VREFCA(DC)  
VREFDQ(DC)  
VREFDQ(SR)  
VTT  
0.5 × VDD  
0.5 × VDD  
0.5 × VDD  
0.5 × VDDQ  
0.51 × VDD  
0.51 × VDD  
VDD  
V
V
V
V
1, 2  
2, 3  
4
I/O reference voltage DQ bus in SELF REFRESH  
Command/address termination voltage  
(system level, not direct DRAM input)  
5
1. VREFCA(DC) is expected to be approximately 0.5 × VDD and to track variations in the DC  
level. Externally generated peak noise (noncommon mode) on VREFCA may not exceed  
1% × VDD around the VREFCA(DC) value. Peak-to-peak AC noise on VREFCA should not ex-  
Notes:  
ceed 2% of VREFCA(DC)  
.
2. DC values are determined to be less than 20 MHz in frequency. DRAM must meet specifi-  
cations if the DRAM induces additional AC noise greater than 20 MHz in frequency.  
3. VREFDQ(DC) is expected to be approximately 0.5 × VDD and to track variations in the DC  
level. Externally generated peak noise (noncommon mode) on VREFDQ may not exceed  
1% × VDD around the VREFDQ(DC) value. Peak-to-peak AC noise on VREFDQ should not ex-  
ceed 2% of VREFDQ(DC)  
.
PDF: 09005aef826aa906  
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
47  
‹ 2006 Micron Technology, Inc. All rights reserved.  
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