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MT41J256M4 参数 Datasheet PDF下载

MT41J256M4图片预览
型号: MT41J256M4
PDF下载: 下载PDF文件 查看货源
内容描述: DDR3 SDRAM MT41J256M4 â ????梅格32 ×4× 8银行MT41J128M8 â ????梅格16 ×8× 8银行MT41J64M16 â ???? 8梅格×16× 8银行 [DDR3 SDRAM MT41J256M4 – 32 Meg x 4 x 8 banks MT41J128M8 – 16 Meg x 8 x 8 banks MT41J64M16 – 8 Meg x 16 x 8 banks]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 214 页 / 2938 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1Gb: x4, x8, x16 DDR3 SDRAM  
On-Die Termination (ODT)  
Table 83: Truth Table – ODT (Nominal)  
Note 1 applies to the entire table  
MR1[9, 6, 2]  
000  
ODT Pin  
DRAM Termination State  
RTT,nom disabled, ODT off  
RTT,nom disabled, ODT on  
RTT,nom enabled, ODT off  
RTT,nom enabled, ODT on  
RTT,nom reserved, ODT on or off  
DRAM State  
Any valid  
Notes  
0
1
0
1
X
2
3
2
3
000  
Any valid except self refresh, read  
Any valid  
000–101  
000–101  
110 and 111  
Any valid except self refresh, read  
Illegal  
1. Assumes dynamic ODT is disabled (see Dynamic ODT (page 195) when enabled).  
Notes:  
2. ODT is enabled and active during most writes for proper termination, but it is not illegal  
for it to be off during writes.  
3. ODT must be disabled during reads. The RTT,nom value is restricted during writes. Dynam-  
ic ODT is applicable if enabled.  
Nominal ODT resistance RTT,nom is defined by MR1[9, 6, 2], as shown in Mode Register 1  
(MR1) Definition. The RTT,nom termination value applies to the output pins previously  
mentioned. DDR3 SDRAM supports multiple RTT,nom values based on RZQ/n where n  
can be 2, 4, 6, 8, or 12 and RZQ is 24±Ω. RTT,nom termination is allowed any time after the  
DRAM is initialized, calibrated, and not performing read access, or when it is not in self  
refresh mode.  
Write accesses use RTT,nom if dynamic ODT (RTT(WR)) is disabled. If RTT,nom is used dur-  
ing writes, only RZQ/2, RZQ/4, and RZQ/6 are allowed (see Table 80 (page 196)). ODT  
timings are summarized in Table 84 (page 194), as well as listed in Table 56 (page 09).  
Examples of nominal ODT timing are shown in conjunction with the synchronous  
mode of operation in Synchronous ODT Mode (page 2±1).  
Table 84: ODT Parameters  
Definition for All  
DDR3 Speed Bins  
Symbol  
ODTLon  
ODTLoff  
tAONPD  
tAOFPD  
ODTH4  
Description  
Begins at  
Defined to  
Unit  
tCK  
tCK  
ns  
ODT synchronous turn-on delay  
ODT synchronous turn-off delay  
ODT asynchronous turn-on delay  
ODT asynchronous turn-off delay  
ODT registered HIGH RTT(ON) tAON  
ODT registered HIGH RTT(OFF) tAOF  
CWL + AL - 2  
CWL + AL - 2  
2–8.5  
ODT registered HIGH  
ODT registered HIGH  
RTT(ON)  
RTT(OFF)  
2–8.5  
4tCK  
ns  
tCK  
ODT minimum HIGH time after ODT ODT registered HIGH ODT registered  
assertion or write (BC4)  
or write registration  
with ODT HIGH  
LOW  
ODTH8  
tAON  
tAOF  
ODT minimum HIGH time after  
write (BL8)  
Write registration  
with ODT HIGH  
ODT registered  
LOW  
6tCK  
tCK  
ps  
ODT turn-on relative to ODTLon  
completion  
Completion of  
ODTLon  
RTT(ON)  
See Table 56 (page 79)  
0.5tCK 0.2tCK  
ODT turn-off relative to ODTLoff  
completion  
Completion of  
ODTLoff  
RTT(OFF)  
tCK  
PDF: 09005aef826aa906  
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
194  
‹ 2006 Micron Technology, Inc. All rights reserved.  
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