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MCP6273-E/CH 参数 Datasheet PDF下载

MCP6273-E/CH图片预览
型号: MCP6273-E/CH
PDF下载: 下载PDF文件 查看货源
内容描述: 170 μA , 2 MHz的轨至轨运算放大器 [170 μA, 2 MHz Rail-to-Rail Op Amp]
分类和应用: 运算放大器
文件页数/大小: 36 页 / 651 K
品牌: MICROCHIP [ MICROCHIP ]
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MCP6271/1R/2/3/4/5  
4.6  
Unused Amplifiers  
VIN–  
VIN+  
VSS  
An unused op amp in a quad package (MCP6274)  
should be configured as shown in Figure 4-6. These  
circuits prevent the output from toggling and causing  
crosstalk. In Circuit A, R1 and R2 produce a voltage  
within its output voltage range (VOH, VOL). The op amp  
buffers this voltage, which can be used elsewhere in  
the circuit. Circuit B uses the minimum number of  
components and operates as a comparator.  
Guard Ring  
Example Guard Ring Layout  
¼ MCP6274 (A)  
¼ MCP6274 (B)  
FIGURE 4-7:  
for Inverting Gain.  
VDD  
VDD  
1. For Inverting Gain and Transimpedance  
Amplifiers (convert current to voltage, such as  
photo detectors):  
VDD  
R1  
a) Connect the guard ring to the non-inverting  
input pin (VIN+). This biases the guard ring  
to the same reference voltage as the op  
amp (e.g., VDD/2 or ground).  
VREF  
R2  
b) Connect the inverting pin (VIN–) to the input  
with a wire that does not touch the PCB  
surface.  
R2  
------------------  
VREF = VDD  
R1 + R2  
2. Non-inverting Gain and Unity Gain Buffer:  
a) Connect the non-inverting pin (VIN+) to the  
input with a wire that does not touch the  
PCB surface.  
FIGURE 4-6:  
Unused Op Amps.  
4.7  
Supply Bypass  
b) Connect the guard ring to the inverting input  
pin (VIN–). This biases the guard ring to the  
common mode input voltage.  
With this family of operational amplifiers, the power  
supply pin (VDD for single supply) should have a local  
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm  
for good, high frequency performance. It also needs a  
bulk capacitor (i.e., 1 µF or larger) within 100 mm to  
provide large, slow currents. This bulk capacitor can be  
shared with nearby analog parts.  
4.8  
PCB Surface Leakage  
In applications where low input bias current is critical,  
Printed Circuit Board (PCB) surface leakage effects  
need to be considered. Surface leakage is caused by  
humidity, dust or other contamination on the board.  
Under low humidity conditions, a typical resistance  
between nearby traces is 1012Ω. A 5V difference would  
cause 5 pA of current to flow. This is greater than the  
MCP6271/1R/2/3/4/5 family’s bias current at 25°C  
(1 pA, typical).  
The easiest way to reduce surface leakage is to use a  
guard ring around sensitive pins (or traces). The guard  
ring is biased at the same voltage as the sensitive pin.  
An example of this type of layout is illustrated in  
Figure 4-7.  
© 2008 Microchip Technology Inc.  
DS21810F-page 15  
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