W3H128M72E-XSBX / W3H128M72E-XNBX
Document Title
1GB – 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History Continued
Rev #
History
Release Date Status
Rev 5
Changes (Pg. 1)
March 2009
Final
5.1 Change "This product is under development, is not fully qualified or
characterized and is subject to change without notice
5.2 Add thinner "NB" version of part is under development. Only difference
between "NB" and "SB" is thickness. "SB" = 4.65mm (0.283) max and
"NB" = 3.97mm (0.156) max; a difference of .68mm (0.027) max
Rev 6
Changes (Pg. 24, 26)
September 2009
Final
6.1 Change ICC2P to 55mA on all speed grades
6.2 Change ICC6 to 45mA on all speed grades
6.3 Change ICC7 to 1,775mA on "400 and 533" speed grades and 1,975mA
on 667 speed grade
6.4 Change tAC to -100ps min on all speed grades and 1,250ps max on 667
speed grade, 1,350ps on 400 and 533 speed grades
6.5 Change tDSA to 400ps on 533 speed grade
6.6 Change tDQSCK to -100ps min on all speed grades and 1,250ps max on
667 speed grade, 1,350ps on 400 and 533 speed grades
Rev 7
Changes (Pg. 1, 29, 30)
March 2010
Final
7.1 Add weight of W3H128M72E-XNBX
7.2 Remove Thinner "NB" note
7.3 Add new W3H128M72E-XNBX package dimension
7.4 Change W3H128M72E-XSBX from 4.65 mm to 4.57 mm
7.5 Change length to 22.10 (0.870) max and width to 16.10 (0.634) max on
both "SB" and "NB" packages.
7.6 Remove note from BGA thermal resistance.
Rev 8
Rev 9
Changes (Pg. 25)
February 2011
August 2011
Final
Final
8.1 Correct tRFC = 195 ns for all speed grades
Changes (Pg. 1, 29, 30)
9.1 Add "1GB" to doc title
9.2 Add "Typical Applications" diagram
Rev 10
Changes (Pg. 26-28)
10.1 Fix typos
January 2012
Final
30
4163.12E-0716-ss-W3H128M72E-XSBX / XNBX
Mercury Corp. - Memory and Storage Solutions • (602) 437-1520 • www.mrcy.com
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
