W3H128M72E-XSBX / W3H128M72E-XNBX
FIGURE 15 – W3H128M72E-XNBX PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY LOW PROFILE (PBGA)
BOTTOM VIEW
208 x Ø 0.60 (0.024) NOM
11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1.0 (0.039)NOM
0.50
(0.020)
NOM
10.0 (0.394) NOM
16.10 (0.634) MAX
3.94 (0.155) MAX
Pads are Solder Mask Defined (SMD), pad opening is 0.48mm
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
27
4163.12E-0716-ss-W3H128M72E-XSBX / XNBX
Mercury Corp. - Memory and Storage Solutions • (602) 437-1520 • www.mrcy.com