W3H128M72E-XSBX / W3H128M72E-XNBX
Document Title
1GB – 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History
Rev #
History
Release Date Status
Rev 0
Initial Release
May 2008
Advanced
Rev 1
Changes (Pg. 1, 2, 22, 33)
September 2008
Advanced
1.1 Weight 4 grams max
1.2 Changed A0-12 to A0-13
1.3 Added input/output capacitance
1.4 Added BGA thermal resistance
Rev 2
Rev 3
Change (Pg. 1)
October 2008
October 2008
Preliminary
Preliminary
2.1 Change SPACE SAVINGS to space savings
Change (Pg. 24)
3.1 Reduce DDR2 ICC7
• CL6 from (1,975 to 1,580) mA
• CL5 from (1,775 to 1,420) mA
• CL4 from (1,775 to 1,420) mA
Rev 4
Change (Pg. 1, 5, 6, 19, 22, 23, 30)
December 2008
Final
4.1 Remove "P" from FBGA, take out "Actual Size" off of Figure 1
4.2 Remove VCCQ; and I/O + core; VCCQ is common to VCC in VCC box
4.3 Change page 8 to page 7 in initialization paragraph
4.4 Change tWT to tWT
4.5 In BGA thermal resistance, change note to read - to obtain the junction
temperature increase, multiply the thermal resistance by the power dissipated
in each die in the MCP
4.6 In DC operating conditions add "and" to note 1
4.7 Put "/" in between Mbs to read Mb/s
4.8 Change data sheet to final
29
4163.12E-0716-ss-W3H128M72E-XSBX / XNBX
Mercury Corp. - Memory and Storage Solutions • (602) 437-1520 • www.mrcy.com
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
