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MX25L1635DMI-12G 参数 Datasheet PDF下载

MX25L1635DMI-12G图片预览
型号: MX25L1635DMI-12G
PDF下载: 下载PDF文件 查看货源
内容描述: 16M - BIT [ ×1 / ×2 / ×4 ] CMOS串行闪存 [16M-BIT [x 1/x 2/x 4] CMOS SERIAL FLASH]
分类和应用: 闪存存储内存集成电路光电二极管时钟
文件页数/大小: 50 页 / 728 K
品牌: Macronix [ MACRONIX INTERNATIONAL ]
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MX25L1635D  
Deep Power-down (DP) instruction to enter, during the Deep Power-down mode, the device is not active and all Write/  
Program/Eraseinstructionareignored. WhenCS#goeshigh, it'sonlyinstandbymodenotdeeppower-downmode. It's  
different from Standby mode.  
The sequence of issuing DP instruction is: CS# goes low-> sending DP instruction code-> CS# goes high. (see Figure  
25)  
OncetheDPinstructionisset,allinstructionwillbeignoredexcepttheReleasefromDeepPower-downmode(RDP)and  
ReadElectronicSignature(RES)instruction. (thoseinstructionsallowtheIDbeingreadingout). WhenPower-down, the  
deeppower-downmodeautomaticallystops, andwhenpower-up, thedeviceautomaticallyisinstandbymode. ForRDP  
instruction the CS# must go high exactly at the byte boundary (the latest eighth bit of instruction code been latched-in);  
otherwise, the instruction will not executed. As soon as Chip Select (CS#) goes high, a delay of tDP is required before  
enteringtheDeepPower-downmode.  
(17)ReleasefromDeepPower-down(RDP), ReadElectronicSignature(RES)  
TheReleasefromDeepPower-down(RDP)instructionisterminatedbydrivingChipSelect(CS#)High.WhenChipSelect  
(CS#) is driven High, the device is put in the Stand-by Power mode. If the device was not previously in the Deep Power-  
downmode,thetransitiontotheStand-byPowermodeisimmediate.IfthedevicewaspreviouslyintheDeepPower-down  
mode, though, the transition to the Stand-by Power mode is delayed by tRES2, and Chip Select (CS#) must remain High  
foratleasttRES2(max),asspecifiedinTable10.ACCharacteristics.OnceintheStand-byPowermode,thedevicewaits  
tobeselected,sothatitcanreceive,decodeandexecuteinstructions.TheRDPinstructionisonlyforreleasingfromDeep  
PowerDownMode.  
RES instruction is for reading out the old style of 8-bit Electronic Signature, whose values are shown as table of ID  
Definitions in next page. This is not the same as RDID instruction. It is not recommended to use for new design. For new  
design, please use RDID instruction.  
The sequence is shown as Figure 26,27. Even in Deep power-down mode, the RDP and RES are also allowed to be  
executed, only except the device is in progress of program/erase/write cycle; there's no effect on the current program/  
erase/write cycle in progress.  
The RES instruction is ended by CS# goes high after the ID been read out at least once. The ID outputs repeatedly if  
continuouslysendtheadditionalclockcyclesonSCLKwhileCS#isatlow. IfthedevicewasnotpreviouslyinDeepPower-  
downmode,thedevicetransitiontostandbymodeisimmediate. IfthedevicewaspreviouslyinDeepPower-downmode,  
there'sadelayoftRES2totransittostandbymode,andCS#mustremaintohighatleasttRES2(max). Onceinthestandby  
mode, the device waits to be selected, so it can be receive, decode, and execute instruction.  
(18) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4)  
The REMS, REMS2 & REMS4 instruction is an alternative to the Release from Power-down/Device ID instruction that  
providesboththeJEDECassignedmanufacturerIDandthespecificdeviceID. TheREMS4instructionisrecommended  
to use for 4 I/O identification and REMS2 instruction is recommended to use for 2 I/O identification.  
The REMS, REMS2 & REMS4 instruction is very similar to the Release from Power-down/Device ID instruction. The  
instruction is initiated by driving the CS# pin low and shift the instruction code "90h" or "EFh" or "DFh"followed by two  
dummy bytes and one bytes address (A7~A0). After which, the Manufacturer ID for MXIC (C2h) and the Device ID are  
shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown in figure 31. The Device ID values  
are listed in Table 7 of ID Definitions in next page. If the one-byte address is initially set to 01h, then the device ID will  
be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously,  
alternating from one to the other. The instruction is completed by driving CS# high.  
P/N:PM1374  
REV. 1.5, OCT. 01, 2008  
22