LTC4270/LTC4271
PACKAGE DESCRIPTION
UKG Package
52-Lead Plastic QFN (7mm × 8mm)
(Reference LTC DWG # 05-08-1729 Rev Ø)
7.50 0.05
6.10 0.05
5.50 REF
(2 SIDES)
0.70 0.05
6.45 0.05
6.50 REF
(2 SIDES)
7.10 0.05 8.50 0.05
5.41 0.05
PACKAGE OUTLINE
0.25 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.50 REF
(2 SIDES)
0.75 0.05
7.00 0.10
(2 SIDES)
R = 0.115
TYP
0.00 – 0.05
51
52
0.40 0.10
PIN 1 TOP MARK
(SEE NOTE 6)
1
2
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 ¥ 45C
CHAMFER
6.45 0.10
8.00 0.10
(2 SIDES)
6.50 REF
(2 SIDES)
5.41 0.10
(UKG52) QFN REV
Ø 0306
R = 0.10
TYP
0.25 0.05
0.50 BSC
TOP VIEW
SIDE VIEW
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
0.75 0.05
NOTE:
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
3. ALL DIMENSIONS ARE IN MILLIMETERS
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
42701f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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Linear [ Linear ]
