LTC4270/LTC4271
PACKAGE DESCRIPTION
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
0.70 0.05
4.50 0.05
3.10 0.05
2.45 0.05
(4 SIDES)
PACKAGE OUTLINE
0.25 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
R = 0.115
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 ¥ 45 CHAMFER
0.75 0.05
4.00 0.10
(4 SIDES)
TYP
23 24
PIN 1
TOP MARK
(NOTE 6)
0.40 0.10
1
2
2.45 0.10
(4-SIDES)
(UF24) QFN 0105
0.200 REF
0.25 0.05
0.00 – 0.05
0.50 BSC
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION
(WGGD-X)—TO BE APPROVED
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
42701f
30
Linear [ Linear ]
