LTC2309
PACKAGE DESCRIPTION
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
0.70 0.05
4.50 0.05
3.10 0.05
2.45 0.05
(4 SIDES)
PACKAGE OUTLINE
0.25 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
R = 0.115
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 s 45° CHAMFER
0.75 0.05
4.00 0.10
(4 SIDES)
TYP
23 24
PIN 1
TOP MARK
(NOTE 6)
0.40 0.10
1
2
2.45 0.10
(4-SIDES)
(UF24) QFN 0105
0.200 REF
0.25 0.05
0.00 – 0.05
0.50 BSC
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
2309f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
Linear [ Linear ]
