iCE40 HX-Series Ultra-Low Power Family
Ordering Information
Figure 2 describes the iCE40HX ordering codes for all packaged components. See the separate DiePlus data sheets
when ordering die-based products. See the separate iCE40 Pinout Excel files for package and pinout specifications.
Figure 2: iCE40HX Ordering Codes (packaged, non-die components)
iCE40HX 8K - CM 225
High Performance
Package Leads
Series
Package Style
Logic Cells
CM= ucBGA (0.4 mm pitch)
1K, 4K, 8K
CB= csBGA (0.5 mm pitch)
CT= caBGA (0.8 mm pitch)
VQ = Very Thin Quad flat pack (0.5 mm pitch)
TQ = Thin Quad flat pack (0.5 mm pitch)
Part Number
iCE40HX1K-VQ100
iCE40HX1K-TQ144
iCE40HX1K-CB132
iCE40HX4K-CB132
iCE40HX4K-TQ144
iCE40HX8K-CB132
iCE40HX8K-CM225
iCE40HX8K-CT256
LUTs
1,280
1,280
1,280
3,520
3,520
7,680
7,680
7,680
Supply Voltage
Temp.
IND
IND
IND
IND
IND
IND
IND
IND
1.2V
1.2V
1.2V
1.2V
1.2V
1.2V
1.2V
1.2V
iCE40HX8K-CM225
225-ball Chip-Scale BGA Package
(7x7 mm footprint, 0.4 mm pitch)
Lattice Semiconductor Corporation
(1.32, 03-OCT-2012)
www.latticesemi.com/
2
LATTICE [ LATTICE SEMICONDUCTOR ]
