TC1767
Electrical Parameters
5.4
Package and Reliability
Package Parameters
5.4.1
Table 26
Device
Thermal Parameters (Operating Conditions apply)
1)
1)
1)
Package
RΘJCT
RΘJCB
RΘJLeads Unit
23 K/W
Note
TC1767 PG-LQFP-176-5
6.5
5.5
1) The top and bottom thermal resistances between the case and the ambient (RTCAT, RTCAB) are to be combined
with the thermal resistances between the junction and the case given above (RTJCT, RTJCB), in order to calculate
the total thermal resistance between the junction and the ambient (RTJA). The thermal resistances between the
case and the ambient (RTCAT, RTCAB) depend on the external system (PCB, case) characteristics, and are
under user responsibility.
The junction temperature can be calculated using the following equation: TJ = TA + RTJA × PD, where the RTJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
RTJA can be obtained from the upper four partial thermal resistances.
Thermal resistances as measured by the ‘cold plate method’ (MIL SPEC-883 Method 1012.1).
Data Sheet
118
V1.3, 2009-09
INFINEON [ Infineon ]
