7.0 PPC740 and PPC750 Microprocessor Package Description
Th e followin g section s provide th e package param eters an d th e m ech an ical dim en sion s
for th e PPC740 an d PPC750.
7.1 Parameters for the 255 CBGA Package (PPC740)
Th e package param eters are as provided in th e followin g list. Th e package type is 21 x
21 m m , 255-lead ceram ic ball grid array (CBGA).
Package outline
Interconnects
21 x 21 mm
255 (16 x 16 ball array - 1)
1.27 mm (50 mil)
2.45 mm
Pitch
Minimum module height
Maximum module height
Ball diameter
3.00 mm
0.89 mm (35 mil)
Note: The PPC740 (255 CBGA) package offering is subject to availability - see your IBM
marketing representative.
PPC740 and PPC750 Hardware Specifications
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Preliminary and subject to change without notice
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