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IBM25EMPPC750DBUB2660 参数 Datasheet PDF下载

IBM25EMPPC750DBUB2660图片预览
型号: IBM25EMPPC750DBUB2660
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 44 页 / 514 K
品牌: IBM [ IBM ]
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Table 14: Pinout Listing for the 255 CBGA Package (Continued)  
Signal Name  
TEA  
Pin Number  
Active  
I/O  
H13  
Low  
Low  
High  
Low  
Low  
High  
High  
Low  
Input  
Input  
Input  
Input  
I/O  
TLBISYNC  
TMS  
C04  
B11  
TRST  
C10  
TS  
J13  
TSIZ0-TSIZ2  
TT0-TT4  
WT  
A13, D10, B12,  
Output  
I/O  
B13, A15, B16, C14, C15  
D02  
Output  
2
F06, F08, F09, F11, G07, G10, H06, H08,  
H09, H11, J06, J08, J09, J11, K07, K10,  
L06, L08, L09, L11  
VDD  
3
F03  
Low  
Output  
VOLTDET  
Note:  
1. These are test signals for factory use only and must be pulled up to OVdd for normal operation.  
2. OVdd inputs supply power to the I/O drivers and Vdd inputs supply power to the processor core.  
3. Internally tied to GND in the 255 CBGA package to indicate to the power supply that a low-voltage pro-  
cessor is present. This is NOT a supply pin.  
PPC740 and PPC750 Hardware Specifications  
24 of 44  
Preliminary and subject to change without notice  
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