4.0 PPC740 and PPC750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PPC740 and PPC750. IBM
offers two ceramic ball grid array (BGA) packages: a 255 CBGA (the PPC740) and a 360
CBGA (the PPC750).
surface. Part B shows the side profile of the 255 CBGA package to indicate the direc-
tion of the top surface view.
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Not to Scale
Part B
Substrate Assembly.
Encapsulation
View
Die
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Figure 13. Pinout of the PPC740 BGA Package as Viewed from the Top Surface
PPC740 and PPC750 Hardware Specifications
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Preliminary and subject to change without notice