Preliminary
CPC710 PCI Bridge and Memory Controller Data Sheet
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
Characteristic
Supply Voltage (Internal Logic)
Supply Voltage (I/O Interface)
PLL Supply Voltage
Symbol
Value
Unit
V
V
DD
0 to 2.56
OV
V
DD
0 to 3.6
0 to 2.5
AV
V
DD
V
Input Voltage (3.3V LVTTL receivers)
Storage Temperature Range
0 to 3.6
V
IN
T
- 65 to +150
°C
STG
Package Thermal Specifications
Airflow
ft/min (m/sec)
Parameter
Symbol
Value
Unit
Junction-to-case thermal resistance
Junction-to-air thermal resistance
θJC
1
n/a
°C/W
16
0 (0)
θJA
12.6
11.4
100 (0.51)
200 (1.02)
°C/W
Note: These specifications are calculated estimates based on the following:
1. CFD Flotherm computer model results
2. 101.5 x 114.5 JEDEC 2S2P thermal test card based on Document JC-15-98-69 (dated Feb. 10, 1998)
3. Power dissipation of 1.26W at sea level
4. No heat sink
Module should be used in accordance with 05L3625 “FC-PBGA Packaging Applications Specifications.” Heat sink should be
attached in accordance with 05L3630 “Bonding heat sinks to cover plates of FC-PBGA modules.”
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