HX6228
DYNAMIC BURN-IN DIAGRAM*
STATIC BURN-IN DIAGRAM*
VDD
VDD
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
VDD
A15
CE
NWE
A13
A8
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
NC
VDD
A15
CE
NWE
A13
A8
R
R
F18
F19
F0
F15
F12
F11
F10
F19
F9
F19
F1
F1
F1
F1
R
R
R
R
R
F17
F16
F7
F6
F5
F4
F3
F2
F8
F13
F14
F1
F1
F1
R
3
R
R
R
R
3
R
R
R
R
4
R
R
R
R
4
5
5
6
6
R
R
R
R
7
A9
7
R
R
R
R
R
A9
8
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
R
R
8
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
9
9
R
R
10
11
12
13
14
15
16
10
11
12
13
14
15
16
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
F1
VDD = 5.6V, R ≤ 10 KΩ, VIH = VDD, VIL = VSS
Ambient Temperature ≥ 125 °C, F0 ≥ 100 KHz Sq Wave
Frequency of F1 = F0/2, F2 = F0/4, F3 = F0/8, etc.
VDD = 5.5V, R ≤ 10 KΩ
Ambient Temperature ≥ 125 °C
*40-Lead Flat Pack burn-in diagrams have similar connections and are available upon request.
ORDERING INFORMATION (1)
6228
H
X
T
S
C
R
SCREEN LEVEL
V=QML Class V
Q=QML Class Q
S=Level S
B=Level B
E=Engr Device (2)
PART NUMBER
PROCESS
X=SOI
TOTAL DOSE
HARDNESS
SOURCE
H=HONEYWELL
PACKAGE DESIGNATION
T=32-Lead FP
A=40-Lead FP
K=Known Good Die
- =Bare die (No Package)
INPUT
BUFFER TYPE
C=CMOS Level
T=TTL Level
R=1x105 rad(SiO2)
F=3x105 rad(SiO2)
H=1x106 rad(SiO2)
N=No Level Guaranteed
(1) Orders may be faxed to 612-954-2051. For technical assistance, contact our Customer Logistics Department at 612-954-2888.
(2) Engineering Device description: Parameters are tested from -55 to 125°C, 24 hr burn-in, IDDSB = 10mA, no radiation guaranteed.
Contact Factory with other needs.
To lea r n m or e a bou t Hon eyw ell Solid Sta te Electr on ics Cen ter ,
visit ou r w eb site a t h ttp ://w w w .ssec.h on eyw ell.com
Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any liability
arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
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