HX6228
PACKAGING
The 128K x 8 SOI SRAM is offered in a custom 32-lead or
40-leadFlatPack.Thepackageisconstructedofmultilayer
ceramic (Al2O3) and features internal power and ground
planes.
board packing density. These capacitors effectively attach
to the internal package power and ground planes. This
design minimizes resistance and inductance of the bond
wire and package, both of which are critical in a transient
radiation environment. All NC (no connect) pins should be
connected to VSS to prevent charge build up in the
radiation environment.
Ceramicchipcapacitorscanbemountedtothepackageby
theusertomaximizesupplynoisedecouplingandincrease
32-LEAD FLAT PACK PINOUT
40-LEAD FLAT PACK PINOUT
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VDD
A15
CE
NWE
A13
A8
A15
VSS
VDD
NWE
CE
A13
A8
A16
VSS
VDD
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
NC
VDD
VSS
NC
1
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
2
2
3
3
4
4
5
5
6
6
7
7
A9
Top
View
A9
8
8
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
VSS
NC
9
9
10
11
12
13
14
15
16
17
18
19
20
10
11
12
13
14
15
16
Top
View
32-LEAD FLAT PACK
All dimensions in inches
Optional capacitors
in cutout
VDD VSS VDD
A
b
C
D
e
0.135 ± 0.015
0.017 ± 0.002
0.004 to 0.009
0.820 ± 0.008
0.050 ± 0.005 [1]
0.600 ± 0.008
E
22018533-001
1
1
Z
b
(width)
E
E2 0.500 ± 0.008
E3 0.040 ref
TOP
VIEW
BOTTOM
VIEW
D
F
F
L
0.750 ± 0.005 [2]
0.295 min [3]
0.026 to 0.045
0.035 ± 0.010
0.080 ref
e
(pitch)
Q
S
U
V
W
X
Y
Z
S
U
0.380 ref
L
Y
X
W
0.050 ref
0.075 ref
Kovar
Lid [4]
Cutout
Area
Ceramic
Body
0.010 ref
A
Lead
Alloy 42
Q
C
0.135 ref
[1] BSC - Basic lead spacing between centers
[2] Where lead is brazed to package
[3] Parts delivered with leads unformed
[4] Lid connected to VSS
V
E2
E3
10
HONEYWELL [ Honeywell ]
