Thermal
20 Thermal
This section describes the thermal specifications of the MPC8548.
20.1 Thermal for Version 2.0 Silicon HiCTE FC-CBGA with Full Lid
This section describes the thermal specifications for the HiCTE FC-CBGA package for revision 2.0
silicon.
Table 80 shows the package thermal characteristics.
Table 80. Package Thermal Characteristics for HiCTE FC-CBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Die junction-to-ambient (natural convection)
Die junction-to-ambient (200 ft/min)
Die junction-to-ambient (200 ft/min)
Die junction-to-board
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
N/A
R
R
R
R
R
R
17
12
11
8
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1, 2
1, 2
1, 2
1, 2
3
JA
JA
JA
JA
JB
θ
θ
θ
θ
θ
3
Die junction-to-case
N/A
0.8
4
JC
θ
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the
interface layer.
20.2 Thermal for Version 2.1.1 and 2.1.2 Silicon FC-PBGA with Full Lid
This section describes the thermal specifications for the FC-PBGA package for revision 2.1.1 silicon.
Table 81 shows the package thermal characteristics.
Table 81. Package Thermal Characteristics for FC-PBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Die junction-to-ambient (natural convection)
Die junction-to-ambient (200 ft/min)
Die junction-to-ambient (200 ft/min)
Die junction-to-board
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
N/A
R
R
R
R
R
18
13
13
9
°C/W
°C/W
°C/W
°C/W
°C/W
1, 2
1, 2
1, 2
1, 2
3
JA
θ
JA
θ
JA
θ
JA
θ
JB
θ
5
MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6
Freescale Semiconductor
127
FREESCALE [ Freescale ]
