Freescale Semiconductor, Inc.
Mechanical Specifications
44-Lead Ceramic-Leaded Chip Carrier (CLCC)
14.6 44-Lead Ceramic-Leaded Chip Carrier (CLCC)
M
S
S
S
L
0.18 (0.007)
T N -P
B
-N-
Y BRK
M
S
S
S
L
0.18 (0.007)
T N -P
U
D
-L-
W
S
D
G1
DETAIL D-D
44
1
M
S
S
S
L
0.25 (0.010)
T N -P
-P-
M
M
M
-P
M
0.20 (0.008)
T L
N
V
NOTES:
1. DATUMS -L-, -N-, AND -P- DETERMINED
WHERE TOP OF LEAD SHOULDER EXIT
BODY.
2. DIMINSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING
PLANE.
3. DIMINSIONS R AND U DO NOT INCLUDE
GLASS MENISCUS. ALLOWABLE GLASS
RUNOUT IS 0.25 (0.010) PER SIDE.
M
S
S
S
S
0.18 (0.007)
0.18 (0.007)
T L
N
-P
-P
A
R
M
S
S
T L
N
4. DIMINSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
C
E
MILLIMETERS
INCHES
MIN
0.685
0.685
0.165
0.090
0.013
DIM MIN
MAX
17.40 17.65
17.40 17.65
MAX
0.695
0.695
0.180
0.110
0.019
0.10 (0.004)
A
B
C
E
J
G
SEATING
PLANE
-T-
4.20
2.29
0.33
4.57
2.79
0.48
DETAIL S
G1
F
S
S
S
S
0.25 (0.010)
T L
N
-P
G
H
J
K
R
S
U
V
W
Y
1.27 BSC
0.050 BSC
0.66
0.51
0.64
0.81
0.026
0.020
0.025
0.650
0.273
0.650
0.042
0.042
---
0.032
---
---
---
---
16.51 16.66
6.94 7.26
16.51 16.66
0.656
0.286
0.656
0.048
0.048
0.020
0.630
---
M
M
S
S
S
0.18 (0.007)
0.18 (0.007)
T L
N
-P
L
H
S
S
S
T N -P
1.07
1.07
---
1.21
1.21
0.50
G1 14.99 16.00
K1 1.02 ---
0.590
0.040
K1
K
M
M
S
S
S
-P
0.18 (0.007)
0.18 (0.007)
T L
N
F
S
S
S
L
T N -P
DETAIL S
Figure 14-4. MC68HC705C8AFS Package Dimensions (Case #777B)
MC68HC705C8A — Rev. 3
MOTOROLA
Technical Data
Mechanical Specifications
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