Freescale Semiconductor, Inc.
Mechanical Specifications
14.5 44-Lead Plastic-Leaded Chip Carrier (PLCC)
M
S
S
N
0.007(0.180)
T
L-M
B
D
-N-
YBRK
M
S
S
0.007(0.180)
T
L-M
N
U
Z
-M-
-L-
V
X
G1
W
D
44
1
S
S
S
N
0.010 (0.25)
T
L-M
VIEW D-D
M
M
S
S
S
S
A
R
0.007(0.180)
0.007(0.180)
T
T
L-M
L-M
N
N
M
S
S
N
0.007(0.180)
T
L-M
H
Z
J
K1
E
0.004 (0.10)
G
K
C
SEATING
PLANE
-T-
G1
F
VIEW S
S
S
S
M
S
S
0.010 (0.25)
T
L-M
N
0.007(0.180)
T
L-M
N
VIEW S
NOTES:
INCHES
MIN
MILLIMETERS
1.DATUMS -L-, -M-, AND -N- ARE DETERMINED
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2.DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3.DIMENSION R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
DIM
MAX
0.695
0.695
0.180
0.110
0.019
MIN
17.40
17.40
4.20
MAX
17.65
17.65
4.57
A
B
0.685
0.685
0.165
0.090
0.013
C
E
2.29
2.79
F
0.33
0.48
4.DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5.CONTROLLING DIMENSION: INCH.
G
H
J
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.650
0.650
0.032
0.66
0.51
0.81
6.THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETERMINED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
7.DIMINSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940198). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
K
R
0.64
0.656
0.656
0.048
0.048
0.056
0.020
10°
16.51
16.51
1.07
16.66
16.66
1.21
1.21
1.42
0.50
10°
U
V
W
X
Y
Z
0.042
0.042
0.042
1.07
1.07
2°
2°
15.50
1.02
G1
K1
0.610
0.040
0.630
16.00
Figure 14-3. MC68HC705C8AFN Package Dimensions (Case #777)
Technical Data
194
MC68HC705C8A — Rev. 3
Mechanical Specifications
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