Freescale Semiconductor, Inc.
Mechanical Specifications
14.3 40-Pin Plastic Dual In-Line Package (PDIP)
40
21
20
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
B
C
D
F
51.69
13.72
3.94
52.45
14.22
5.08
2.035
0.540
0.155
0.014
0.040
2.065
0.560
0.200
0.022
0.060
B
1
0.36
0.56
1.02
1.52
2.54 BSC
0.100 BSC
G
H
J
K
L
L
A
1.65
0.20
2.92
2.16
0.38
3.43
0.065
0.008
0.115
0.085
0.015
0.135
C
N
15.24 BSC
0.600 BSC
0°
1°
0°
1°
M
N
0.51
1.02
0.020
0.040
J
K
SEATING
PLANE
M
H
G
F
D
NOTES:
1.POSITION TOLERANCE OF LEADS (D), SHALL
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2.DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3.DIMENSION B DOES NOT INCLUDE MOLD FLASH.
Figure 14-1. MC68HC705C8AP Package Dimensions (Case #711)
Technical Data
192
MC68HC705C8A — Rev. 3
Mechanical Specifications
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