Freescale Semiconductor, Inc.
Mechanical Specifications
40-Pin Ceramic Dual In-Line Package (Cerdip)
14.4 40-Pin Ceramic Dual In-Line Package (Cerdip)
40
1
21
20
B
A
L
N
C
INCHES
DIM MIN MAX
MILLIMETERS
DATUM
PLANE
T
MIN MAX
K
A
B
C
D
F
2.020 2.096 51.31 53.23
0.500 0.610 12.70 15.94
0.160 0.240 4.06 6.09
0.015 0.022 0.38 0.55
0.050 0.065 1.27 1.65
SEATING
PLANE
J
G
M
F
D40 PL
φ 0.25(0.010)
G
J
0.100 BSC
0.008 0.012 0.20 0.30
2.54 BSC
T A
M
M
K
L
M
0.125 0.160 3.17 4.06
0.600 BSC
0° 15°
0.020 0.050 0.51 1.27
15.24 BSC
0° 15°
N
Figure 14-2. MC68HC705C8AS Package Dimensions (Case #734A)
MC68HC705C8A — Rev. 3
MOTOROLA
Technical Data
Mechanical Specifications
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