Freescale Semiconductor, Inc.
Technical Data — MC68HC705C8A
Section 15. Ordering Information
15.1 Contents
15.2 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .199
15.3 MCU Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .199
15.2 Introduction
This section contains ordering information for the available package
types.
15.3 MCU Order Numbers
Table 15-1 lists the MC order numbers.
Table 15-1. MC68HC705C8A Order Numbers
Package Type
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Order Number
(1) (2)
40-pin plastic dual in-line package (PDIP)
44-lead plastic-leaded chip carrier (PLCC)
44-lead ceramic-leaded chip carrier (CLCC)
40-pin windowed ceramic DIP (Cerdip)
44-pin quad flat pack (QFP)
MC68HC705C8AC
P
(3)
MC68HC705C8ACFN
MC68HC705C8ACFS
(4)
(5)
MC68HC705C8ACS
MC68HC705C8ACFB
(6)
(7)
42-pin shrink dual in-line package (SDIP)
MC68HC705C8ACB
1. C = Extended temperature range (–40°C to +85°C)
2. P = Plastic dual in-line package (PDIP)
3. FN = Plastic-leaded chip carrier (PLCC)
4. FS = Ceramic-leaded chip carrier (CLCC)
5. S = Windowed ceramic dual in-line package (Cerdip)
6. FB = Quad flat pack (QFP)
7. B = Shrink dual in-line package (SDIP)
MC68HC705C8A — Rev. 3
Technical Data
MOTOROLA
Ordering Information
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