Freescale Semiconductor, Inc.
Mechanical Specifications
42-Pin Shrink Dual In-Line Package (SDIP)
14.8 42-Pin Shrink Dual In-Line Package (SDIP)
-A-
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
42
1
22
21
-B-
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
INCHES
MIN MAX
MILLIMETERS
MIN MAX
L
DIM
A
B
C
D
F
1.435 1.465 36.45 37.21
0.540 0.560 13.72 14.22
H
C
0.155 0.200
0.014 0.022
0.032 0.046
0.070 BSC
3.94
0.36
0.81
5.08
0.56
1.17
G
H
J
1.778 BSC
7.62 BSC
0.300 BSC
-T-
SEATING
PLANE
0.008 0.015
0.115 0.135
0.600 BSC
0.20
2.92
0.38
3.43
K
L
N
G
15.24 BSC
M
F
M
N
0° 15°
0.020 0.040
0°
0.51
15°
1.02
K
J 42 PL
0.25 (0.010)
D 42 PL
M
S
B
M
S
A
T
0.25 (0.010)
T
Figure 14-6. MC68HC705C8AB Package Dimensions (Case #858)
MC68HC705C8A — Rev. 3
MOTOROLA
Technical Data
Mechanical Specifications
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