Freescale Semiconductor, Inc.
Technical Data — MC68HC705C8A
Section 14. Mechanical Specifications
14.1 Contents
14.2 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .191
14.3 40-Pin Plastic Dual In-Line Package (PDIP). . . . . . . . . . . . . .192
14.4 40-Pin Ceramic Dual In-Line Package (Cerdip) . . . . . . . . . . .193
14.5 44-Lead Plastic-Leaded Chip Carrier (PLCC) . . . . . . . . . . . .194
14.6 44-Lead Ceramic-Leaded Chip Carrier (CLCC) . . . . . . . . . . .195
14.7 44-Pin Quad Flat Pack (QFP). . . . . . . . . . . . . . . . . . . . . . . . .196
14.8 42-Pin Shrink Dual In-Line Package (SDIP). . . . . . . . . . . . . .197
14.2 Introduction
Package dimensions available at the time of this publication for the
MC68HC705C8A are provided in this section. The packages are:
• 40-pin plastic dual in-line package (PDIP)
• 40-pin ceramic dual-in-line package (cerdip)
• 44-lead plastic-leaded chip carrier (PLCC)
• 44-lead ceramic-leaded chip carrier (CLCC)
• 44-pin quad flat pack (QFP)
• 42-pin shrink dual in-line package (SDIP)
MC68HC705C8A — Rev. 3
MOTOROLA
Technical Data
Mechanical Specifications
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