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M14D5121632A-2.5BIG2H 参数 Datasheet PDF下载

M14D5121632A-2.5BIG2H图片预览
型号: M14D5121632A-2.5BIG2H
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, BGA-84]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 62 页 / 1001 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M14D5121632A (2H)  
Operation Temperature Condition (TC) -40°C~95°C  
< RL= 4 (AL= 0; CL= 4); BL=8 >  
T4  
T0  
T1  
T2  
T5  
T6  
T7  
T8  
T3  
CLK  
CLK  
Bank A  
Active  
Posted CAS  
WRITE A  
CMD  
Precharg A  
NOP  
> = tRP  
NOP  
NOP  
NOP  
NOP  
NOP  
AL+2 clks + max(tRTP;2)  
DQS,DQS  
DQs  
CL = 4  
RL = 4  
AL = 0  
DoutA0  
DoutA4 DoutA5  
DoutA7  
DoutA1  
DoutA3  
DoutA6  
DoutA2  
>= tRAS  
Burst Write Followed by Precharge  
Minimum Write to Precharge command spacing to the same bank = WL + BL/2 clocks + tWR  
.
For write cycles, a delay must be satisfied from the completion of the last burst write cycle until the Precharge command can be  
issued. This delay is known as a write recovery time (tWR) referenced from the completion of the Burst Write to the Precharge  
command. No Precharge command should be issued prior to the tWR delay.  
< WL= (RL-1) = 3; BL=4>  
T4  
T0  
T1  
T2  
T5  
T6  
T7  
T8  
T3  
CLK  
CLK  
Posted CAS  
WRITE A  
Precharg A  
CMD  
NOP  
> = tWR  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
DQS,DQS  
DQs  
WL = 3  
DinA0  
DinA1  
DinA2 DinA3  
< WL= (RL-1) = 4; BL=4 >  
T4  
T3  
T0  
T1  
T2  
T5  
T6  
T7  
T9  
CLK  
CLK  
Posted CAS  
WRITE A  
Precharg A  
CMD  
NOP  
NOP  
> = tWR  
NOP  
NOP  
NOP  
NOP  
NOP  
DQS,DQS  
DQs  
WL = 4  
DinA0  
DinA1  
DinA2 DinA3  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Aug. 2011  
Revision : 1.1 46/62  
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