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M14D5121632A-2.5BIG2H 参数 Datasheet PDF下载

M14D5121632A-2.5BIG2H图片预览
型号: M14D5121632A-2.5BIG2H
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, BGA-84]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 62 页 / 1001 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M14D5121632A (2H)  
Operation Temperature Condition (TC) -40°C~95°C  
Burst Write followed by Burst Read  
< RL= 5 (AL= 2; CL= 3); WL= 4; BL= 4 >  
T4  
T0  
T1  
T2  
T5  
T6  
T7  
T9  
T8  
T3  
CLK  
CLK  
Write to Read = CL -1+BL/2+tWTR  
NOP  
Posted CAS  
READ A  
CMD  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
DQS  
DQS  
DQS,DQS  
AL = 2  
WL = RL -1 = 4  
CL = 3  
RL = 5  
> = tWTR  
DoutA0  
DQ  
DinA0 DinA1 DinA2 DinA3  
Note: The minimum number of clock from the Burst Write command to the Burst Read command is [CL - 1 + BL/2  
+ tWTR]. This tWTR is not a write recovery time (WR) but the time required to transfer the 4 bit write data from  
the input buffer into sense amplifiers in the array.  
Seamless Burst Write  
< RL= 5; WL= 4; BL= 4 >  
T4  
T0  
T1  
T2  
T5  
T6  
T7  
T8  
T3  
CLK  
CLK  
Posted CAS  
WRITE A  
Posted CAS  
WRITE B  
CMD  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
DQS,DQS  
WL = RL-1 = 4  
DQs  
DinA0 DinA1 DinA2  
DinA3 DinB0  
DinB3  
DinB1 DinB2  
Note: The seamless burst write operation is supported by enabling a Write command at every other clock for BL =  
4 operation, and every 4 clock for BL = 8 operation. This operation is allowed regardless of same or different  
banks as long as the banks are activated.  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Aug. 2011  
Revision : 1.1 42/62  
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