ORDERING INFORMATION
Table 8
Package
Part Number
Marking
Burn In
Temperature
DEI1066-SES-G
DEI1066-SES
16 SOIC NB G
No
-55 / +85 ºC
E4
DEI1066-SMS
E4
DEI1066-SMB
E4
DEI1066-SMS-G
DEI1066-SMB-G
16 SOIC NB G
16 SOIC NB G
No
-55 / +125 ºC
-55 / +125 ºC
96hr / +125 ºC
DEI reserves the right to make changes to any products or specifications herein. DEI makes no warranty, representation, or
guarantee regarding suitability of its products for any particular purpose.
©2018 Device Engineering, Inc.
Page 11 of 11
DS-MW-01066-01 Rev J
04/18/2018