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CS51313GDR16 参数 Datasheet PDF下载

CS51313GDR16图片预览
型号: CS51313GDR16
PDF下载: 下载PDF文件 查看货源
内容描述: CPU同步降压控制器能够实现多线性稳压器 [Synchronous CPU Buck Controller Capable of Implementing Multiple Linear Regulators]
分类和应用: 稳压器控制器
文件页数/大小: 20 页 / 249 K
品牌: CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
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Application Information: continued  
where  
PGATE(H) = upper MOSFET gate driver (IC) losses;  
caused by sudden and fast load changes. These load tran-  
sients can have slew rates as high as 20A/µs.  
QGATE(H) = total upper MOSFET gate charge;  
FSW = switching frequency;  
“Droop” Resistor for Adaptive Voltage Positioning  
and Current Limit  
VGATE(H) = upper MOSFET gate voltage.  
The lower (synchronous) MOSFET gate driver (IC) losses  
are:  
Adaptive voltage positioning is used to help keep the out-  
put voltage within specification during load transients. To  
implement adaptive voltage positioning a “Droop  
PGATE(L) = QGATE(L) × FSW × VGATE(L)  
,
Resistor” must be connected between the output inductor  
and output capacitors and load. This resistor carries the  
full load current and should be chosen so that both DC and  
AC tolerance limits are met. An embedded PC trace resis-  
tor has the distinct advantage of near zero cost implemen-  
tation. However, this droop resistor can vary due to three  
reasons: 1) the sheet resistivity variation caused by varia-  
tion in the thickness of the PCB layer; 2) the mismatch of  
L/W; and 3) temperature variation.  
where  
PGATE(L) = lower MOSFET gate driver (IC) losses;  
QGATE(L) = total lower MOSFET gate charge;  
FSW = switching frequency;  
VGATE(L) = lower MOSFET gate voltage.  
The junction temperature of the control IC is primarily a  
function of the PCB layout, since most of the heat is  
removed through the traces connected to the pins of the  
IC.  
1) Sheet Resistivity  
Step 9: Slope Compensation  
For one ounce copper, the thickness variation is typically  
1.26 mil to 1.48 mil. Therefore the error due to sheet resis-  
tivity is:  
Voltage regulators for today’s advanced processors are  
expected to meet very stringent load transient require-  
ments. One of the key factors in achieving tight dynamic  
voltage regulation is low ESR at the CPU input supply  
pins. Low ESR at the regulator output results in low out-  
put voltage ripple. The consequence is, however, that  
there’s very little voltage ramp at the control IC feedback  
pin (VFB) and regulator sensitivity to noise and loop insta-  
bility are two undesirable effects that can surface. The per-  
formance of the CS51313-based CPU VCC(CORE) regulator is  
improved when a fixed amount of slope compensation is  
added to the output of the PWM Error Amplifier (COMP  
pin) during the regulator Off-Time. Referring to Figure 12,  
the amount of voltage ramp at the COMP pin is dependent  
on the gate voltage of the lower (synchronous) FET and the  
value of resistor divider formed by R1and R2.  
1.48 - 1.26  
= ±8%.  
1.37  
2) Mismatch due to L/W  
The variation in L/W is governed by variations due to the  
PCB manufacturing process. The error due to L/W mis-  
match is typically 1%.  
3) Thermal Considerations  
Due to I2 × R power losses the surface temperature of the  
droop resistor will increase causing the resistance to  
increase. Also, the ambient temperature variation will con-  
tribute to the increase of the resistance, according to the  
formula:  
R = R20 [1+ α20(Τ−20)],  
-t  
R2  
R1 + R2  
VSLOPECOMP = VGATE(L)  
×
× (1 eτ ),  
(
)
where  
where  
R20 = resistance at 20˚C;  
VSLOPECOMP = amount of slope added;  
GATE(L) = lower MOSFET gate voltage;  
R1, R2 = voltage divider resistors;  
t = tOFF (switch off-time);  
τ = RC constant determined by C1 and the parallel com-  
bination of R1, R2 (Figure 12), neglecting the low driver  
output impedance  
0.00393  
V
α =  
;
˚C  
T= operating temperature;  
R = desired droop resistor value.  
For temperature T = 50˚C, the % R change = 12%.  
The artificial voltage ramp created by the slope compensa-  
tion scheme results in improved control loop stability pro-  
vided that the RC filter time constant is smaller than the  
off-time cycle duration (time during which the lower MOS-  
FET is conducting).  
Droop Resistor Tolerance  
Tolerance due to sheet resistivity variation  
Tolerance due to L/W error  
Tolerance due to temperature variation  
Total tolerance for droop resistor  
±8%  
1%  
12%  
21%  
Step 10: Selection of Current Limit Filter Components  
In order to determine the droop resistor value the nominal  
voltage drop across it at full load has to be calculated. This  
voltage drop has to be such that the output voltage at full  
load is above the minimum DC tolerance spec:  
The current limit filter is implemented by a 0.1µF ceramic  
capacitor across and two 510resistors in series with the  
V
FB and VOUT current limit comparator input pins. They  
provide a time constant τ = RC = 100µs, which enables the  
circuit to filter out noise and be immune to false triggering,  
16  
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