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ADC701JH 参数 Datasheet PDF下载

ADC701JH图片预览
型号: ADC701JH
PDF下载: 下载PDF文件 查看货源
内容描述: [暂无描述]
分类和应用: 转换器
文件页数/大小: 15 页 / 112 K
品牌: BB [ BURR-BROWN CORPORATION ]
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OFFSET, GAIN AND CONVERSION  
SPEED ADJUSTMENTS (OPTIONAL)  
to the ground plane connections. For example, the ADC701  
output data lines will sink current (statically and/or dynami-  
cally) when in the low state. This current comes from the  
power supply that runs the interface logic, and so must  
return to that supply’s ground. If the ground termination is  
placed such that this digital current will flow away from the  
ADC701, then the existing ground plane will suffice to carry  
the current. On the other hand, if the ground termination  
must be placed such that the digital current flows across the  
ADC or SHC layout, then it would be advisable to break the  
analog ground plane under the package (to stop the flow of  
current across the package) and to provide a separate trace  
(several centimeters wide) on another PC board layer to  
carry the digital return current from pins 11 and 19 to the  
termination point. If the ADC701 must interface into a fairly  
noisy digital environment, then another approach is to keep  
the first layer of latches and/or buffers connected to the  
ADC701 power and ground planes, so that the ADC itself is  
connected to “quiet” circuits with short return paths. This  
transfers the interface problem to the outputs of the latches,  
where it can be managed with less impact on the analog  
components.  
Adjustment of the reference voltage is the most straightfor-  
ward way to adjust the ADC gain. For the internal reference,  
this is accomplished by connecting a 20kpotentiometer as  
shown in Figure 3. This will provide a gain trim range of  
about ±3%. It is also possible to use external series or  
parallel resistance in the input network, but that is more  
cumbersome and usually will degrade the gain stability over  
temperature due to tempco (temperature coefficient) mis-  
matches among the resistors.  
ADC offset may be adjusted by connecting a 500kpoten-  
tiometer to pins 21 and 22, with the wiper connected  
through a series 30kresistor to ground as shown in Figure  
3. This will provide an offset trim range of approximately  
±0.25% FSR. For a larger trim range of offset or gain, it is  
recommended that trims be accomplished elsewhere in the  
system.  
The Clock Adjust input (pin 18) is intended primarily for  
small adjustments of the conversion time. However, this  
will rarely be necessary because the ADC701 is guaranteed  
to convert up to 512kHz over the specified temperature  
range without external clock adjustment.  
PHYSICAL INSTALLATION  
The packages may be soldered directly into a PC board or  
mounted in low-profile machined pin sockets with good  
results. Use of tall (long lead length) sockets, adapters or  
headers is not recommended unless a local ground plane and  
bypass capacitors can be mounted directly under the pack-  
ages.  
POWER AND GROUND CONNECTIONS  
Experience with testing and applying the ADC701 shows  
that it will perform well in most board layouts, provided that  
appropriate care is taken with grounding and bypassing.  
Power supplies may be shared between the ADC701, SHC702  
and other analog circuitry without difficulty. It is recom-  
mended that each power pin be locally bypassed to the  
ground plane with a high quality tantalum capacitor of at  
least 1µF. If at all possible, power should be derived from  
well-regulated linear supplies—switching power supplies  
will require much more effort for proper decoupling and are  
not recommended for this or any high performance wide-  
band analog system.  
In a room-temperature environment or inside an enclosure  
with moderate airflow, the ADC701 and SHC702 normally  
do not require heat-sinking. However, to keep the devices  
running as cool as possible, it is helpful to install a thin heat-  
transfer plate under the packages to conduct heat into the  
ground plane. The plate may be made from metal (copper,  
aluminum or steel) or from a special heat-conductive mate-  
rial such as Sil-Pad(1). The Sil-Pad material has the advan-  
tage of being electrically insulating and somewhat pliable,  
so that it will tend to distribute pressure evenly and conform  
to the package—an advantage in systems where the board  
may be flexed or subjected to vibration.  
The +5V Digital supply pins, though not as sensitive to  
noise as the +5V Analog pin, should nonetheless be kept as  
quiet as possible. If the system digital supply is noisy, then  
it is best to use the system +5V analog supply for all of the  
+5V connections on the ADC701 and SHC702 rather than  
trying to separate them. If only one +5V supply is available  
and it is shared with other system logic, then extra bypassing  
and/or supply filtering may be required.  
PC BOARD LAYOUT  
An optimized layout has been designed for the DEM-  
ADC701-E demonstration fixture. For information concern-  
ing the demo board and the layout, contact your local sales  
representative.  
The –5V supply will operate with any voltage between –  
4.75 and –6V. If –5V is not available from the system  
supplies, then an industry-standard 7905 regulator may be  
used to derive –5V from the –15V supply.  
All ground pins on both the ADC701 and the SHC702  
should be connected directly to a common ground plane.  
This is true for both analog and digital grounds. However,  
it is also helpful to recognize where the digital ground  
currents flow in the system, and to provide PC board return  
paths for potentially troublesome digital currents in addition  
®
10  
ADC701/SHC702  
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