Revision J – April 7, 2006
S2004 – Quad Serial Backplane Device
Data Sheet
Figure 14. Compact 23mm x 23mm 208 TBGA Package
PACKAGE MATERIAL NOTE:
Standard Package: Ball Composition - 62/36/2 Sn/Pb/Ag.
Green / RoHS Compliant Package: Ball Composition - 96.5/3/0.5 Sn/Ag/Cu.
Table 18. Thermal Management
θja (Still Air)
θjc
Device
Device Weight*
S2004
3.9g
17.7°C/W
3.5°C/W
* Tolerance: ± 0.05g
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