ADV7390/ADV7391/ADV7392/ADV7393
OUTLINE DIMENSIONS
5.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
25
24
32
1
PIN 1
INDICATOR
0.50
BSC
TOP
VIEW
3.25
3.10 SQ
2.95
EXPOSED
PAD
(BOTTOM VIEW)
4.75
BSC SQ
0.50
0.40
0.30
17
16
8
9
0.25 MIN
0.80 MAX
0.65 TYP
3.50 REF
12° MAX
EXPOSED PADDLE MUST BE SOLDERED
TO PCB GROUND FOR PROPER
HEAT DISSIPATION, NOISE IMMUNITY AND
MECHANICAL STRENGTH BENEFITS.
0.05 MAX
0.02 NOM
1.00
0.85
0.80
0.30
0.23
0.18
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 142. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
6.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
31
40
1
30
PIN 1
INDICATOR
0.50
BSC
TOP
VIEW
4.25
4.10 SQ
3.95
5.75
BCS SQ
EXPOSED
PAD
(BOT TOM VIEW)
0.50
0.40
0.30
21
10
20
0.25 MIN
4.50
REF
12° MAX
0.80 MAX
0.65 TYP
EXPOSED PADDLE MUST BE SOLDERED
TO PCB GROUND FOR PROPER
HEAT DISSIPATION, NOISE IMMUNITY AND
MECHANICAL STRENGTH BENEFITS.
0.05 MAX
0.02 NOM
1.00
0.85
0.80
0.30
0.23
0.18
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 143. 40-Lead Frame Chip Scale Package [LFCSP]
(CP-40)
Dimensions shown in millimeters
Rev. 0 | Page 95 of 96
ADI [ ADI ]
