AD9364
Data Sheet
ABSOLUTE MAXIMUM RATINGS
REFLOW PROFILE
The AD9364 reflow profile is in accordance with the JEDEC
JESD20 criteria for Pb-free devices. The maximum reflow
temperature is 260°C.
Table 11.
Parameter
Rating
VDDx to VSSx
VDD_INTERFACE to VSSx
VDD_GPO to VSSx
Logic Inputs and Outputs to
VSSx
−0.3 V to +1.4 V
−0.3 V to +3.0 V
−0.3 V to +3.9 V
−0.3 V to VDD_INTERFACE + 0.3 V
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Input Current to Any Pin
Except Supplies
RF Inputs (Peak Power)
Tx Monitor Input Power (Peak
Power)
Package Power Dissipation
10 mA
Table 12. Thermal Resistance
Airflow
2.5 dBm
9 dBm
Package
Type
Velocity
(m/sec)
1, 2
1, 3
1, 4
1, 2
θJA
θJC
9.6
θJB
20.2
ΨJT
Unit
°C/W
°C/W
°C/W
144-Ball
CSP_BGA
0
32.3
29.6
27.8
0.27
0.43
0.57
(TJMAX − TA)/θJA
110°C
1.0
2.5
Maximum Junction
Temperature (TJMAX
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
)
1 Per JEDEC JESD51-7, plus JEDEC JESD51-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-STD 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Rev. B | Page 10 of 32
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