Appendix A
Appendix A forms a part of SMD 5962-90965
10. Scope
10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified
Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers
approved QML plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using
chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of
military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number
(PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.
10.2 PIN. The PIN is as shown in the following example:
5962
F
90965
01
Q
9
|
X
|
|
|
|
|
|
|
|
|
|
|
Federal
stock class
designator
RHA
Device
type
(see 10.2.2)
Device
class
(see 10.2.3)
Die
Die
designator
(10.2.1)
Code
(see 10.2.4)
details
(see 10.2.5)
\___________ __________/
V
Drawing number
10.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit function
Bin speed
03
05
1020B
RH1020
2000 gate, field programmable gate array
2000 gate, field programmable gate array
168.2 ns
168.2 ns
10.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as
follows:
Device class
Q or V
Device requirements documentation
Certification and qualification to MIL-PRF-38535
10.2.4 Die code. The die code designator shall be a number 9 for all devices supplied as die only with no case outline.
10.2.5 Die details. The die details designation shall be a unique letter which designates the die’s physical dimensions, bonding
pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product
and variant supplied to this appendix.
10.2.5.1 Die physical dimensions.
Device type
Die size
Die thickness
Die Detail
Figure Number
03
05
254 mils X 267 mils
254 mils X 267 mils
15±1 mils
25±1 mils
A
B
A-1
A-1
10.2.5.2 Die bonding pad locations and electrical functions.
Device type
Die Detail
Figure Number
03
05
A
B
A-1
A-1
10.2.5.3 Interface materials.
Device type
Top metalization
Backside metalization
None (backgrind)
None (backgrind)
Die Detail
Figure Number
03
05
Ti-cap+Al/Cu/Si,9-12kA
TiW+Al/Cu,9-12kA
A
B
A-1
A-1
10.2.5.4 Assembly related information.
Device type
Glassivation
Die Detail
A
B
Figure Number
A-1
A-1
03
05
Ox/Nitride
Ox/Nitride/Polyimide
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-90965
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
G
19
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
