4.4.4.2 Single event phenomena (SEP). SEP testing shall be required on class V devices. SEP testing shall be performed on
the Standard Evaluation Circuit (SEC) or alternate SEP test vehicle as approved by the qualifying activity at initial qualification
and after any design or process changes which may affect the upset or latchup characteristics. Test four devices with zero
failures. ASTM standard F1192 may be used as a guideline when performing SEP testing. The test conditions for SEP are as
follows:
a. The package lid of the DUT is removed so as to provide an unobstructed path to the die for the ion beam.
b. The DUT is biased or exercised as appropriate to that IC being tested.
c. The temperature that SEP tests are conducted at is 25°C +/- 10°C (ambient).
d. Particle penetration range is > 20 microns (Si).
e. The flux used is between 1E2 and 1E5 ions/cm2/s.
f. The beam incidence angle(s) used are between 0° to 60° from normal.
g. Supply current and voltage(s) as well as SEU, SEL and faults are monitored and recorded in-situ.
h. For SEP test limits, see Table IB herein.
4.5 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded before
and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical parameters to be
measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option, either perform delta
measurements or within 24 hours after burn-in perform final electrical parameter tests, subgroups 1, 7,
and 9.
4.6 Programming procedures. The programming procedures shall be as specified by the device manufacturer and shall be
made available upon request.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-STD-883 (see 3.1 herein) for
device class M and MIL-PRF-38535 for device classes Q and V.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43218-3990, or telephone
(614) 692-0547.
SIZE
STANDARD
5962-90965
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET
16
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
