30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient
to make the packaged die capable of meeting the electrical performance requirements in table IA.
30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer,
shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in 10.2
herein. The certification mark shall be “QML” or “Q” as required by MIL-PRF-38535.
30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of compliance
submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s
product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein.
30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall
be provided with each lot of microcircuit die delivered to this drawing.
30.8 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in
a wide variety of configurations; two processing options are provided for selection in the contract, using an altered item drawing.
30.8.1 Unprogrammed die delivered to the user. All testing shall be verified through wafer probe test as defined in 40.2.
30.8.2 Manufacturer-programmed die delivered to the user. The programming integrity test shall be performed during
programming. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
40. QUALITY ASSURANCE PROVISIONS
40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance
with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM
plan shall not affect the form, fit, or function as described herein.
40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the
manufacturer’s QM plan. As a minimum it shall consist of:
a) Wafer lot acceptance for Class V product using the criteria within MIL-STD-883 test method 5007.
b) 100% wafer probe (see paragraph 30.4)
c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 test method 2010 or
the alternate procedures allowed within MIL-STD-883 test method 5004.
40.3 Conformance inspection.
40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see
30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of
packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs 4.4.4.1,
4.4.4.1.1, and 4.4.4.2 herein.
50. DIE CARRIER
50.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or as
specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and
electrostatic protection.
60. NOTES
60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with
MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit application (original equipment), design applications and
logistics purposes.
60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43216-5000 or telephone
(614)-692-0536.
60.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined within MIL-
PRF-38535 and MIL-HDBK-1331.
60.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA and have
agreed to this drawing.
SIZE
STANDARD
5962-90965
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
G
SHEET
21
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
