MIL-PRF-38535K
APPENDIX A
A.4.3.2.3 Nondestructive tests. The following tests are classified as nondestructive:
Barometric pressure
** Steady-state life
** Intermittent life
*** Solderability (for lead finish A only)
Seal
External visual
Internal visual (pre-cap)
** Burn-in screen
Radiography
Particle impact noise detection (PIND)
Physical dimensions
Nondestructive 100 percent bond pull test where stress does not exceed the specified pull force and
positive tolerance
Resistance to solvents
C-SAM (TM 2030)
** When the test temperature exceeds the maximum specified junction temperature for the device (including
maximum specified for operation or test), these tests may be considered destructive. To ship these tested
devices, the manufacturer shall have data to support that the test is not destructive and has not degraded the
device.
*** For glass sealed devices, lead finish A shall be considered nondestructive unless electrical test, visual inspection,
or other evaluation shows that package integrity or electrical performance has been degraded.
A.4.3.3 Formation of lots. Microcircuits shall be segregated into identifiable production lots as defined in A.3.1.3.6
as required to meet the production control and inspection requirements of A.4.8. Microcircuits shall be formed into
inspection lots as defined in A.3.1.3.7 and A.3.1.3.8 as required to meet the quality assurance inspection and test
requirements of this specification.
Wafer lot processing, as a homogeneous group (see A.3.1.3.11), shall be accomplished by any of the following
procedures, providing process schedules and controls are sufficiently maintained to assure identical processing in
accordance with process instructions of all wafers in the lot:
a. Batch processing of all wafers in the wafer lot through the same machine process step(s) simultaneously.
b. Continuous or sequential processing (wafer by wafer or batch portions of wafer lot) of all wafers through the
same machine or process step(s).
c. Parallel processing of portions of the wafer lot through multiple machines or process stations on the same
certified line, provided statistical quality control assures and demonstrates correlation between stations and
separately processed portions of the wafer lot.
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ACTEL [ Actel Corporation ]
